Deliverable D3.3

Title: Optimised antenna array design with simulation and measurement results for final integration
Date:  Oct. 2019
Dissemination: Confidential
Abstract: This deliverable describes the work done during the second year of DREAM in Work Package 3. Antenna element, antenna array and test structure designs are shown along with measurements results. Printed circuit board technology has been shown to be a viable technology for D-band antenna and MMIC integration. Low-loss substrate materials are available and high-end PCB manufacturers are capable of building the required laminates. Semi-additive PCB production method (mSAP) is used to facilitate the required patterning accuracy for D-band circuits. Antenna elements and antenna arrays have been designed, characterized and reported. S-parameters show good correlation and radiation patterns are similar to simulated, thus validating the design methodology and manufacturing method.  Next step is to integrate the phased array MMICs to the substrate along with antennas.
Keywords: D-band, antennas, antenna arrays.