Jan 27

DREAM will be at 6G Wireless Summit 2020 in Levi – Finland

A team of researchers of the DRAM project will attend the 6G – Wireless Summit in Levi, Lapland – Finland from 17 to 20 March 2020.

The following paper will be presented:

Characterization of Interconnects on Multilayer High Frequency PCB for D-Band”, by Antti Lamminen, Markku Lahti, David del Rio, Jussi Säily, Juan F. Sevillano and Vladimir Ermolov.

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