A team of researchers of the DRAM project will attend the 6G – Wireless Summit ( https://www.6gsummit.com/) in Levi, Lapland – Finland from 17 to 20 March 2020.
The following paper will be presented:
“Characterization of Interconnects on Multilayer High Frequency PCB for D-Band”, by Antti Lamminen, Markku Lahti, David del Rio, Jussi Säily, Juan F. Sevillano and Vladimir Ermolov.